The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Jun. 19, 2012
Applicants:

Stephen Gonya, Endicott, NY (US);

Jim Patterson, Owego, NY (US);

Kenn Twigg, Sayre, PA (US);

Inventors:

Stephen Gonya, Endicott, NY (US);

Jim Patterson, Owego, NY (US);

Kenn Twigg, Sayre, PA (US);

Assignee:

Lockheed Martin Corporation, Bethesda, MA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a frame attachment interconnect between a substrate and a frame is disclosed. The method can include applying a composite material (e.g., epoxy-glass prepreg) to a surface of a substrate. The composite material can have one or more holes disposed to substantially align with a corresponding pad on the surface of the substrate. A metal disc is placed in each hole of the composite material on top of the corresponding pad. A frame member can be placed on top of the composite material and the metal discs. The frame member can have one or more pads disposed to substantially align with the metal discs. The substrate, composite material, metal discs and frame combination can be cured in a controlled atmosphere that can include a vacuum and a predetermined temperature to create discrete electrical connections between adjacent pads but with each encapsulated and electrically isolated.


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