This inventor holds 3 USPTO granted patents. Top assignee: Quanta Computer Incorporated. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Jim-Fat Tseng: Innovator in Heat Dissipation Technology
Introduction
Jim-Fat Tseng is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of 3 patents. His innovative designs focus on improving the efficiency of electronic devices by effectively managing heat.
Latest Patents
One of his latest patents is a heat-dissipation device with an elastic member and a heat-dissipation method. This invention provides a comprehensive solution for electronic devices that include a heat source, a thermal interface material (TIM), and a heat-dissipation module. The elastic member plays a crucial role by pushing the heat-dissipation module toward the heat source, ensuring optimal heat transfer. The method involves overlapping the TIM and heat-dissipation module on the heat source and applying force to enhance heat dissipation.
Another notable patent is a heat dissipation device designed to manage heat from a heat source. This device features a control unit, a sensor, and two heat dissipation modules. The sensor detects the temperature of the heat source and communicates with the control unit. When the temperature exceeds a predetermined threshold, the control unit activates a driving mechanism to extend the second heat dissipation module, thereby improving heat management.
Career Highlights
Jim-Fat Tseng is currently employed at Quanta Computer Incorporated, a leading company in the technology sector. His work focuses on developing advanced heat management solutions that are essential for modern electronic devices.
Collaborations
Throughout his career, Jim-Fat has collaborated with talented individuals such as Yu-Nien Huang and Shun-Ta Yu. These partnerships have contributed to the successful development of innovative technologies in the field.
Conclusion
Jim-Fat Tseng's contributions to heat dissipation technology highlight his role as a key innovator in the industry. His patents reflect a commitment to enhancing the performance and reliability of electronic devices through effective heat management solutions.