The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Jul. 26, 2005
Yu-nien Huang, Chung Li, TW;
Shun-ta Yu, Taipei, TW;
Cheng-yu Wang, Hsinchu, TW;
Jim-fat Tseng, Kaohsiung, TW;
Tsan-nan Chien, Taipei, TW;
Yu Liu, Tao Yuan, TW;
Yu-Nien Huang, Chung Li, TW;
Shun-Ta Yu, Taipei, TW;
Cheng-Yu Wang, Hsinchu, TW;
Jim-Fat Tseng, Kaohsiung, TW;
Tsan-Nan Chien, Taipei, TW;
Yu Liu, Tao Yuan, TW;
Quanta Computer Inc., Tao Yuan Shien, TW;
Abstract
The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.