Hsinchu, Taiwan

Cheng-Yu Wang


Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 155(Granted Patents)


Company Filing History:


Years Active: 2005-2024

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7 patents (USPTO):Explore Patents

Title: Innovations of Cheng-Yu Wang

Introduction

Cheng-Yu Wang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of display technology and heat dissipation methods. With a total of 7 patents to his name, Wang's work showcases his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is a display device that includes a bezel, first and second light guide plates (LGP), first and second light emitting elements, first and second reflection sheets, a first fixing member, and at least one display panel. Each of the first and second LGPs has a bottom surface, a light exit surface, a light incident surface, and a first side surface. The first and second reflection sheets are strategically located between the bezel and the first LGP and between the bezel and the second LGP, respectively. Bent portions of the first and second reflection sheets are disposed beside the first side surface of the first LGP and the first side surface of the second LGP, respectively, and are located between the first side surface of the first LGP and the first side surface of the second LGP. The first fixing member is sandwiched between the bent portions of the first and second reflection sheets.

Another notable patent is a heat-dissipation device with an elastic member and its corresponding heat-dissipation method. This invention provides an electronic device that includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the TIM, and an elastic member that pushes the heat-dissipation module toward the heat source. The elastic member consists of a base and a compressible portion extending from the base, allowing a force applied to the compressible portion to be transmitted and uniformly distributed on the base. The heat-dissipation method involves overlapping a thermal interface material and a heat-dissipation module on the heat source and exerting a force toward the heat source to the heat-dissipation module.

Career Highlights

Cheng-Yu Wang has worked with notable companies such as Quanta Computer Incorporated and Abocom Systems, Inc. His experience in these organizations has contributed to his development as an inventor and innovator in the technology sector.

Collaborations

Some of his coworkers include Yu-Nien Huang and Shun-Ta Yu

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