Company Filing History:
Years Active: 2012
Title: Innovator Jim Baldino: Pioneering Through-Silicon Via Fabrication
Introduction
Jim Baldino is an accomplished inventor based in Portland, Oregon, known for his significant contributions to the field of microelectronics. With a robust portfolio of two patents, Baldino has developed innovative methods that improve the fabrication of through-silicon vias, crucial components in advancing semiconductor technology.
Latest Patents
Baldino's latest patents revolve around the fabrication of through-silicon vias on silicon wafers. The first patent presents a method that includes etching a plurality of through holes in a silicon plate. An oxide liner is deposited on the surface and sidewalls of the holes, followed by the deposition of a metallic conductor within these holes. Additionally, a silicon nitride passivation layer can be concurrently applied to protect the exposed back surface of the silicon plate.
The second patent details a slightly different fabrication method, where a silicon plate is bonded to a carrier using an adhesive, allowing the back surface to be accessible. Similar to the first patent, this method entails etching through holes in the silicon plate and depositing a metallic conductor to create through-silicon vias, enhancing the connectivity in semiconductor devices.
Career Highlights
Baldino serves as a vital team member at Applied Materials, Inc., a leading provider of manufacturing solutions for the semiconductor industry. His work focuses on developing advanced fabrication techniques that address the needs of modern microelectronics, driving innovation and efficiency in the production process.
Collaborations
Throughout his career, Baldino has collaborated with talented colleagues, including Nagarajan Rajagopalan and Ji Ae Park. Together, they have contributed to groundbreaking advancements in semiconductor technologies, showcasing the power of teamwork and shared expertise in achieving innovative solutions.
Conclusion
Jim Baldino's work as an inventor continues to shape the landscape of microelectronics through his inventive methodologies for through-silicon via fabrication. His contributions not only enhance semiconductor technology but also underscore the importance of innovation in driving the industry forward. Through collaboration and dedication, Baldino exemplifies the spirit of ingenuity necessary to meet contemporary challenges in the tech world.