This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: **Jigneshkumar P. Patel: Innovator in Semiconductor Technology**
Introduction
Jigneshkumar P. Patel is a noteworthy inventor based in Chandler, AZ, who has made significant contributions to the field of semiconductor technology. With one patent to his name, Patel stands out for his ingenuity and commitment to advancing innovations in multi-chip packages.
Latest Patents
Jigneshkumar Patel’s patent is titled "Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control." This invention embodies advanced semiconductor packages that incorporate a plurality of first dies on a substrate, an encapsulation layer, and an interface layer that thermally couples the dies to a passive heat spreader made from silicon or silicon carbide. The innovative use of various materials such as silicon nitride, silicon monoxide, and thermal adhesive further enhances the thermal management in semiconductor applications, ensuring efficient heat distribution across multi-chip systems.
Career Highlights
Jigneshkumar Patel is currently employed at Intel Corporation, a leading organization in semiconductor manufacturing. Throughout his career, he has been instrumental in developing solutions that address the critical thermal challenges faced in stacked die configurations within multi-chip packages. His work embodies the spirit of innovation that Intel is renowned for.
Collaborations
In his professional journey, Jigneshkumar Patel has collaborated with notable colleagues, including Xavier Francois Brun and Kaizad Rumy Mistry. These collaborations have allowed for the exchange of ideas and expertise, profoundly influencing the direction of Patel’s research and development endeavors.
Conclusion
Jigneshkumar P. Patel exemplifies the innovative spirit of today’s engineers and inventors. His contributions to semiconductor technology, particularly in improving thermal solutions for stacked dies, play a crucial role in enhancing the performance and reliability of modern electronic devices. As he continues to push the boundaries of innovation, Patel remains an inspiring figure in the field of semiconductor engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
