Jie-Mo Lin

Title: Jie-Mo Lin: Innovator in Semiconductor Technology

Introduction

Jie-Mo Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to semiconductor packaging.

Latest Patents

One of Jie-Mo Lin's latest patents is a semiconductor package structure. This structure includes a redistribution structure, a chip, an upper dielectric layer, a plurality of conductive members, and an encapsulation layer. The redistribution structure consists of a redistribution layer and a first dielectric layer disposed on the redistribution layer. The upper dielectric layer is positioned between the chip and the first dielectric layer of the redistribution structure, with both layers made of organic materials. A plurality of conductive members is situated between the redistribution layer and the chip, where each conductive member has a first end adjacent to the chip and a second end adjacent to the redistribution structure. The first end of each conductive member contacts the upper dielectric layer, while the second end contacts the first dielectric layer.

Another notable patent by Jie-Mo Lin is the redistribution layer structure of a semiconductor package. This structure includes a dielectric layer with a specific thickness, at least one upper conductive wire on the first surface of the dielectric layer, and at least one lower conductive wire on the second surface. Vias penetrate the dielectric layer, connecting the upper and lower conductive wires. Each via has a cross-section at one upper conductive wire, with a third width. The ratio of the third width to the thickness of the dielectric layer is less than or equal to 1, while the ratio of the pitch between adjacent vias to the third width is greater than or equal to 0.5.

Career Highlights

Jie-Mo Lin has worked with notable organizations such as the Industrial Technology Research Institute and the Intellectual Property Innovation Corporation. His experience in these institutions has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Throughout his career, Jie-Mo Lin has collaborated with talented individuals, including Shu-Wei Kuo and Wei-Yuan Cheng. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Jie-Mo Lin is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the field. His patents reflect his innovative spirit and dedication to improving semiconductor packaging solutions.