Jie Mao

Title: Innovations by Jie Mao in Power Conversion Technology

Introduction

Jie Mao is a notable inventor based in San Jose, California, recognized for his contributions to power conversion technology. With a total of two patents to his name, he has made significant advancements in the field, particularly while working at Texas Instruments Corporation.

Latest Patents

One of Jie Mao's latest patents is a power converter featuring a conductive clip. This innovative power supply module includes a metallic clip with a plate and two ridges that are bent in the same direction away from the plate. The design allows for effective conductivity and integration with a substrate made of insulating material. The module incorporates two MOS field-effect transistor (FET) chips, a driver and controller chip, and a capacitor, all working together to enhance power conversion efficiency.

Another significant patent is the open cavity package using chip-embedding technology. This method involves fabricating packaged semiconductor devices with an open cavity in a panel format. The process includes placing a grid of metallic pieces on adhesive carrier tape, attaching semiconductor chips face-down, and laminating insulating material to fill gaps. The assembly undergoes several processes, including plasma cleaning and metal layer patterning, to create rerouting traces and extended contact pads.

Career Highlights

Jie Mao's career at Texas Instruments Corporation has been marked by his innovative approach to semiconductor technology. His work has contributed to the development of advanced power supply modules and packaging techniques that enhance the performance and reliability of electronic devices.

Collaborations

Jie Mao has collaborated with talented coworkers, including Hau Thanh Nguyen and Luu Thanh Nguyen, to drive innovation within the company. Their combined expertise has led to the successful development of cutting-edge technologies in the semiconductor industry.

Conclusion

Jie Mao's contributions to power conversion technology and semiconductor packaging have established him as a prominent inventor in his field. His innovative patents reflect a commitment to advancing technology and improving electronic device performance.