This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Jicun Lu: Innovator in Electronic Packaging
Introduction
Jicun Lu is a notable inventor based in Rancho Cordova, CA (US). He has made significant contributions to the field of electronic packaging. His innovative work has led to the development of a unique patent that enhances the efficiency of electronic devices.
Latest Patents
Jicun Lu holds a patent for "Electronic packages with dice landed on wire bonds." This invention describes a stacked dice electronic package that eliminates the need for spacers between the dice. The design allows an overlying die to be landed directly on the wire bonds of the underlying die, which can improve the performance and reliability of electronic packages.
Career Highlights
Jicun Lu is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has positioned him as a key player in the development of innovative electronic solutions.
Collaborations
One of his notable coworkers is Charles A. Gealer. Together, they contribute to the advancement of technology in their respective fields.
Conclusion
Jicun Lu's contributions to electronic packaging through his patent and work at Intel Corporation highlight his role as an influential inventor. His innovative designs continue to shape the future of electronic devices.