Beijing, China

Jiarui Dong


Average Co-Inventor Count = 7.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2021

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3 patents (USPTO):

Title: Jiarui Dong: Innovator in Electromagnetic Defect Detection

Introduction

Jiarui Dong is a prominent inventor based in Beijing, China. He has made significant contributions to the field of defect detection and evaluation through innovative methods and devices. With a total of 3 patents, his work focuses on utilizing electromagnetic multi-field coupling to enhance the accuracy and efficiency of defect detection in pipelines.

Latest Patents

One of Jiarui Dong's latest patents is a "Method and device for detecting and evaluating defect." This patent outlines a comprehensive approach that includes magnetizing a pipeline, detecting defects along its axial direction, and collecting three-dimensional magnetic leakage signals along with electrical impedance signals. The method emphasizes pre-processing and decoupling these signals to perform impedance analysis and quantification evaluation using neural networks. Another notable patent is the "Method for reconstructing defect," which involves establishing a database of magnetic flux leakage signals and utilizing a forward model to predict and scale the size of defects based on target signals.

Career Highlights

Jiarui Dong has worked at esteemed institutions such as Tsinghua University and Nanchang Hangkong University. His experience in these research environments has allowed him to develop and refine his innovative techniques in defect detection.

Collaborations

Throughout his career, Jiarui Dong has collaborated with notable colleagues, including Songling Huang and Wei Zhao. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Jiarui Dong's innovative work in electromagnetic defect detection showcases his expertise and commitment to advancing technology in this critical field. His contributions are paving the way for more effective methods of evaluating and reconstructing defects in various applications.

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