Hsinchu, Taiwan

Jiann-Liang Liou


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: **The Innovative Contributions of Jiann-Liang Liou in Semiconductor Technology**

Introduction

Jiann-Liang Liou, an esteemed inventor based in Hsinchu, Taiwan, has made significant strides in the field of semiconductor technology. With a focus on improving the adhesion of molding compounds, his innovative approach demonstrates a keen understanding of material properties and their applications in modern manufacturing processes.

Latest Patents

One of Jiann-Liang Liou's most notable patents is titled "Method to improve adhesion of molding compound by providing an oxygen rich film over the top surface of a passivation layer." This invention presents a novel method for treating the surface of passivation layers, specifically those composed of silicon dioxide or silicon nitride. The patent describes two embodiments: in the first, a layer of silicon oxide is deposited on a substrate, followed by plasma-enhanced silicon nitride, culminating in an oxynitride layer. The second embodiment simplifies the process with a direct oxidation of the silicon nitride layer via N2O or O plasma treatment. This advancement addresses the critical challenge of enhancing adhesion in semiconductor devices, thereby improving their performance and reliability.

Career Highlights

Jiann-Liang Liou currently works at Taiwan Semiconductor Manufacturing Company Limited, where he applies his expertise in semiconductor fabrication. His career is marked by a commitment to innovation and quality, contributing towards the continued success and leadership of the company in the global semiconductor industry.

Collaborations

Throughout his career, Jiann-Liang has collaborated with several talented individuals, including Chie-Ming Yang and Hui-Chi Lin. These partnerships reflect a strong team-oriented approach to advancing technology, fostering a spirit of innovation within the workplace.

Conclusion

Jiann-Liang Liou exemplifies the spirit of innovation that drives the semiconductor industry forward. His contributions, particularly through his patent on improving adhesion in molding compounds, highlight the importance of creative problem-solving in engineering and manufacturing. As technology continues to evolve, the work of inventors like Liou will undoubtedly play a crucial role in shaping the future of semiconductor devices.

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