Company Filing History:


Years Active: 2017-2020
Title: Innovations by Jianlei Yang
Introduction
Jianlei Yang is a prominent inventor based in Beijing, China. He has made significant contributions to the field of technology, particularly in the development of innovative solutions for electronic components. With a total of 5 patents to his name, Yang's work focuses on enhancing the efficiency and sustainability of electronic manufacturing processes.
Latest Patents
Yang's latest patents include the FPC flattening jig and FPC flattening method. The FPC flattening jig features a pressurization mechanism and a heating mechanism. The bottom of the pressurization mechanism has a planar base surface that contacts a warped flexible printed circuit (FPC) to exert pressure. The heating mechanism heats the pressurization mechanism, ensuring that the planar base surface reaches a predefined temperature while applying pressure to the FPC. This innovative approach allows for the flattening of warped FPCs, enabling their reuse and improving the recycling rate of FPC materials. Another notable patent is the maintenance fixture for printed circuit board assembly. This fixture is designed to prevent the scrapping of printed circuit boards (PCBs) when removing conductive adhesives. It includes a cover plate and a support baseplate, which work together to protect electronic components during maintenance.
Career Highlights
Throughout his career, Jianlei Yang has worked with notable companies such as BOE Technology Group Co., Ltd. and Hefei BOE Optoelectronics Technology Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in the electronics industry.
Collaborations
Yang has collaborated with talented individuals in his field, including Yongkang Hou and Yu Zhang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Jianlei Yang's contributions to the field of technology through his patents and collaborations highlight his commitment to innovation. His work not only addresses current challenges in electronic manufacturing but also paves the way for a more sustainable future in the industry.