The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10219420 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 26, 2019

Filed:

Apr. 26, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Boe Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventors:

Yongkang Hou, Beijing, CN;

Yu Zhang, Beijing, CN;

Jianlei Yang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 13/04 (2006.01); G02F 1/13 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0486 (2013.01); G02F 1/1309 (2013.01); G02F 1/13454 (2013.01); Y10T 29/53274 (2015.01);
Abstract

The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.


Find Patent Forward Citations

Hou, Yongkang. (2019). Integrated circuit chip extractor (U.S. Patent No. 10219420). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10219420

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