The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

May. 31, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Boe Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Yongkang Hou, Beijing, CN;

Jianlei Yang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B30B 15/34 (2006.01); H05K 3/22 (2006.01); H05K 3/00 (2006.01); B30B 1/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/22 (2013.01); B30B 1/24 (2013.01); B30B 15/34 (2013.01); H05K 3/0014 (2013.01); H05K 3/225 (2013.01); H05K 2201/09136 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1509 (2013.01);
Abstract

A FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped FPC to exert pressure thereon; the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the FPC. The FPC flattening jig heats the pressurization mechanism by a heating mechanism, and then the heated planar base surface of the pressurization mechanism contacts the warped FPC and exerts pressure thereon. Therefore, the FPC can be flattened. As such, the FPC can be reused, facilitating the improvement on the recycling rate of FPC.


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