Jianhua Shu

Title: Innovations of Jianhua Shu in Conductive Adhesive Technology

Introduction

Jianhua Shu is a notable inventor based in Beijing, China. He has made significant contributions to the field of conductive adhesive technology. His innovative work has led to the development of a unique conductive adhesive film that has applications in various electronic devices.

Latest Patents

Jianhua Shu holds a patent for a conductive adhesive film and its fabrication method, as well as for an electronic device and its manufacturing method. The patent describes a conductive adhesive film that includes a first film layer and a conductive particle layer. The first film layer features multiple electrode contact regions and a non-contact region that separates these regions. Additionally, the film layer contains several gap structures located in the non-contact region. The conductive particle layer, which includes conductive particles, is positioned on one side of the first film layer. Notably, the orthographic projection of the conductive particles on the first film layer overlaps with at least a portion of each electrode contact region.

Career Highlights

Throughout his career, Jianhua Shu has worked with prominent companies in the technology sector. He has been associated with Chengdu BOE Optoelectronics Technology Co., Ltd. and BOE Technology Group Co., Ltd. His experience in these organizations has contributed to his expertise in the field of conductive materials.

Collaborations

Jianhua Shu has collaborated with several professionals in his field, including Shaopeng Li and Weiben Zhang. These collaborations have likely enhanced his research and development efforts in conductive adhesive technologies.

Conclusion

Jianhua Shu's innovative work in conductive adhesive films showcases his expertise and contributions to the electronics industry. His patent reflects a significant advancement in the field, and his collaborations further highlight the importance of teamwork in driving innovation.