The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Nov. 26, 2021
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Shaopeng Li, Beijing, CN;

Weiben Zhang, Beijing, CN;

Jianhua Shu, Beijing, CN;

Rongkun Fan, Beijing, CN;

Qiang Gou, Beijing, CN;

Tao Su, Beijing, CN;

Hao Deng, Beijing, CN;

Tianjun Deng, Beijing, CN;

Xiaolong Tang, Beijing, CN;

Wenze Li, Beijing, CN;

Cheng Zhang, Beijing, CN;

Fakui Sun, Beijing, CN;

Jing Zhang, Beijing, CN;

Yuan Liu, Beijing, CN;

Dingjie Huang, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/20 (2018.01); C09J 9/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 7/20 (2018.01); C09J 9/02 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); C09J 2203/326 (2013.01); C09J 2301/16 (2020.08); C09J 2301/204 (2020.08); C09J 2301/206 (2020.08); C09J 2301/208 (2020.08); H01L 2224/27 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/83851 (2013.01);
Abstract

A conductive adhesive film is disclosed. The conductive adhesive film includes a first film layer and a conductive particle layer. The first film layer has a plurality of electrode contact regions and a non-contact region separating the plurality of electrode contact regions. The first film layer has a plurality of gap structures, and the plurality of gap structures are located at least in the non-contact region. The conductive particle layer is located on a side of the first film layer. The conductive particle layer includes conductive particles. An orthographic projection of the conductive particles on the first film layer overlaps with at least a portion of each electrode contact region.


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