Beijing, China

Hao Deng

USPTO Granted Patents = 1 

Average Co-Inventor Count = 15.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hao Deng: Innovator in Conductive Adhesive Technology

Introduction

Hao Deng is a notable inventor based in Beijing, China. He has made significant contributions to the field of conductive adhesive technology. His innovative work has led to the development of a unique conductive adhesive film that has applications in electronic devices.

Latest Patents

Hao Deng holds a patent for a conductive adhesive film and its fabrication method, as well as the manufacturing method for electronic devices utilizing this film. The patent describes a conductive adhesive film that includes a first film layer and a conductive particle layer. The first film layer features multiple electrode contact regions and a non-contact region that separates these regions. Additionally, the film layer contains several gap structures located in the non-contact region. The conductive particle layer, which includes conductive particles, is positioned on one side of the first film layer. Notably, the orthographic projection of the conductive particles on the first film layer overlaps with at least a portion of each electrode contact region.

Career Highlights

Throughout his career, Hao Deng has worked with prominent companies in the technology sector. He has been associated with Chengdu BOE Optoelectronics Technology Co., Ltd. and BOE Technology Group Co., Ltd. These experiences have allowed him to refine his skills and contribute to advancements in electronic materials.

Collaborations

Hao Deng has collaborated with several professionals in his field, including Shaopeng Li and Weiben Zhang. These partnerships have fostered innovation and the exchange of ideas, further enhancing the development of conductive adhesive technologies.

Conclusion

Hao Deng's contributions to the field of conductive adhesive technology exemplify his innovative spirit and dedication to advancing electronic materials. His patent and career achievements highlight the importance of collaboration and innovation in driving technological progress.

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