Nantong, China

Jiangen Shi

This inventor holds 1 USPTO granted patent. Top assignee: Nantong Fujitsu Microelectronics Co., Ltd.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiangen Shi. Retrieved from https://idiyas.com/inventor/jiangen-shi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2016

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations in Wafer-Level Packaging by Jiangen Shi

Introduction

Jiangen Shi, an inventor based in Nantong, China, has made significant contributions to the field of semiconductor technology. His innovative methods in wafer-level packaging have paved the way for advancements in electronics and manufacturing processes.

Latest Patents

Jiangen Shi holds a patent titled "Method and structure for wafer-level packaging." This patent describes a comprehensive method for wafer-level packaging that includes providing a semiconductor wafer with multiple semiconductor chips connected by connection stems. This innovative approach involves forming through holes in the connection stems and applying a protective layer that covers the wafer, incorporating upper, lower, and middle protective layers. The method culminates in the formation of individual semiconductor chip structures by cutting the wafer along the connection stems, ultimately enhancing the efficiency and effectiveness of semiconductor packaging.

Career Highlights

Jiangen Shi is associated with Nantong Fujitsu Microelectronics Co., Ltd., where his expertise and creativity shine through his work on semiconductor technologies. His contributions to the industry have showcased his ability to innovate and push the boundaries of traditional packaging methods.

Collaborations

Throughout his career, Jiangen Shi has likely collaborated with various professionals and researchers in the semiconductor field, exchanging knowledge and ideas to further enhance his contributions. Such collaborations play a crucial role in innovation, fostering an environment where inventors can thrive and develop cutting-edge technologies.

Conclusion

With a focus on advancing semiconductor packaging techniques, Jiangen Shi stands out as a notable inventor whose work is poised to impact the electronics industry significantly. His patent demonstrates a commitment to innovation, showcasing how inventive methods can improve existing processes and lead to more efficient manufacturing in the semiconductor space.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…