Lexington, KY, United States of America

Jiandong Fang

This inventor holds 18 USPTO granted patents and 4 published patent applications, primarily in Micro-Fluid Ejection. Top assignees: Funai Electric Company Ltd., Lexmark International, Inc., Other. Active years: 2013-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiandong Fang. Retrieved from https://idiyas.com/inventor/jiandong-fang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 38.9

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 25(Granted Patents)


Location History:

  • Lexnigton, KY (US) (2013)
  • Lexington, KY (US) (2013 - 2017)

Company Filing History:


Years Active: 2013-2017

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Areas of Expertise:
Micro-Fluid Ejection
Inkjet Printheads
Ejection Chips
Fluid Ejection Devices
Skewed Nozzle Arrays
Substrate Structure
Partitioned Array
Chevron Ejection
Fabrication Methods
Printhead Assembly
Fluid Jetting
18 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Jiandong Fang

Introduction

Jiandong Fang, an accomplished inventor based in Lexington, KY, has made significant strides in the realm of micro-fluid ejection devices. With a remarkable portfolio of 18 patents, his innovative solutions continue to push the boundaries of technology in various industries.

Latest Patents

Among his numerous contributions, Jiandong Fang's latest patent involves laminate constructs for micro-fluid ejection devices. This inventive design features a micro-fluid ejection head equipped with an ejection chip that expels fluid. The chip connects to a laminate construct that comprises vertically configured wiring layers, interspersed with non-conductive layers, such as carbon fiber. The upper wiring layer establishes an electrical connection with the ejection chip and may also support its planar undersurface, either directly on a surface or within a recessed pocket. Connections can be facilitated through a die bond, using materials such as silica or boron nitride. This design integrates fluid connections between ink feed slots of the chip and the laminate construct, while potentially involving a silicon tile or alternative materials for fluid interconnection. Additionally, a plastic manifold can support this laminate construct, ensuring efficient fluid connectivity. The intricate wiring layers are designed to accommodate grounding, power, and various bond pads, while other layers may incorporate prepreg or core FR4 materials.

Career Highlights

Jiandong Fang has held prominent positions at reputable companies, including Funai Electric Company Ltd. and Lexmark International, Inc. His work in these organizations has been pivotal in advancing the technical capabilities of micro-fluid technologies and related innovations.

Collaborations

Throughout his career, Jiandong has collaborated with notable colleagues, including Frank Edward Anderson and Richard Earl Corley. Together, they have contributed to the development of cutting-edge technologies, underscoring the importance of teamwork in the innovation process.

Conclusion

Jiandong Fang's contributions to the field of micro-fluid ejection devices exemplify the power of innovation and collaboration. With his extensive patent portfolio and continued commitment to developing advanced technologies, he remains a pivotal figure in his industry, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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