The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Jun. 24, 2013
Funai Electric Co., Ltd., Osaka, JP;
Xiaorong Cai, Lexington, KY (US);
Jiandong Fang, Lexington, KY (US);
Xiaoming Wu, Lexington, KY (US);
Elaine Yeap Money, Lexington, KY (US);
Eunki Hong, Lexington, KY (US);
Yimin Guan, Lexington, KY (US);
Burton Joyner, II, Lexington, KY (US);
Sean Terrance Weaver, Union, KY (US);
David Graham, Lexington, KY (US);
Zach Reitmeier, Oak Ridge, NC (US);
Funai Electric Co., Ltd., Osaka, JP;
Abstract
Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.