Company Filing History:
2 out of 2 
1 out of 1 Years Active: 2023-2025
Title: Innovations of Jian Jing in Silicon Wafer Technology
Introduction
Jian Jing is a notable inventor based in Hangzhou, China, recognized for his contributions to silicon wafer technology. With a total of three patents to his name, he has made significant advancements in the field, particularly in mechanisms that enhance the processing of silicon wafers.
Latest Patents
Jian Jing's latest patents include a "Turnaround Mechanism of Silicon Wafers" and a "Device for Degumming and Inserting Silicon Wafers and Method for Processing Silicon Wafers." The turnaround mechanism features a material frame, supporting components, and clamping components designed to efficiently handle silicon wafers. This innovative mechanism allows for the clamping and releasing of supports, facilitating the separation of silicon wafers. The device for degumming and inserting silicon wafers includes a material frame, grabbing mechanism, degumming mechanism, unlocking mechanism, and inserting mechanism, all working together to streamline the processing of silicon wafers.
Career Highlights
Jian Jing has worked with prominent companies such as Hangzhou Zhongwei Photoelectric Technology Co., Ltd. and Hangzhou Zhongwei Photoelectronic Technology Co., Ltd. His experience in these organizations has contributed to his expertise in silicon wafer technology and innovation.
Collaborations
Throughout his career, Jian Jing has collaborated with talented individuals, including Hong Li and Jian Wang, who have contributed to his projects and innovations.
Conclusion
Jian Jing's work in silicon wafer technology showcases his inventive spirit and dedication to advancing the field. His patents reflect a commitment to improving processes and devices that are essential in the semiconductor industry.