The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Aug. 14, 2022
Hangzhou Zhongwei Photoelectric Technology Co., Ltd., Hangzhou, CN;
Hong Li, Hangzhou, CN;
Hong Chen, Hangzhou, CN;
Jian Jing, Hangzhou, CN;
Jiangshui Zhang, Hangzhou, CN;
Jun Wang, Hangzhou, CN;
Guangquan Zhang, Hangzhou, CN;
Pucha Hu, Hangzhou, CN;
HANGZHOU ZHONGWEI PHOTOELECTRIC TECHNOLOGY CO., LTD., Hangzhou, CN;
Abstract
The present disclosure provides a device () for degumming and inserting silicon wafers and method for processing silicon wafers. The device () for degumming and inserting silicon wafers includes a material frame (), a grabbing mechanism (), a degumming mechanism (), an unlocking mechanism () and an inserting mechanism (). The material frame () is configured for placing and clamping a plurality of silicon wafers () bonded with a support (), the grabbing mechanism () is configured for grabbing and transferring the material frame () or the support (), the degumming mechanism () is configured for degumming the plurality of silicon wafers () from the support (), the unlocking mechanism () is configured for releasing clamping and fixing of the material frame () on the plurality of silicon wafers (), and the inserting mechanism () is configured for splitting the degummed plurality of silicon wafers ().