Jian-Jhih Li

Title: Innovations by Jian-Jhih Li

Introduction

Jian-Jhih Li is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of silicon products, particularly in the manufacturing of wafers. With a total of 2 patents to his name, his work focuses on enhancing the mechanical properties of silicon wafers.

Latest Patents

Jian-Jhih Li's latest patents include a method for creating a wafer formed by slicing an ingot. This innovative process involves a wafer that has at least one side surface adjacent to the slicing path, which is topped with a nanostructure layer. His second patent details a nanostructuring process for the ingot surface prior to slicing. This process includes a surface treatment step that forms a nanostructure layer on at least one surface of the ingot. The nanostructure layer enhances the mechanical strength of the ingot surface, thereby reducing the chipping ratio of the wafer during slicing.

Career Highlights

Jian-Jhih Li is currently employed at Sino-American Silicon Products Inc., where he continues to innovate in the field of silicon wafer manufacturing. His work has been instrumental in improving the quality and efficiency of silicon products.

Collaborations

Some of his notable coworkers include Wen-Ching Hsu and Jiunn-Yih Chyan, who contribute to the collaborative efforts in their projects.

Conclusion

Jian-Jhih Li's contributions to the field of silicon wafer manufacturing through his innovative patents demonstrate his commitment to advancing technology in this area. His work not only enhances product quality but also sets a foundation for future innovations in the industry.