The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Jan. 19, 2012
Applicants:
Jiunn-yih Chyan, Hinchu, TW;
Jian-jhih LI, Hsinchu, TW;
Kun-lin Yang, Hsinchu, TW;
Wen-ching Hsu, Hsinchu, TW;
Inventors:
Jiunn-Yih Chyan, Hinchu, TW;
Jian-Jhih Li, Hsinchu, TW;
Kun-Lin Yang, Hsinchu, TW;
Wen-Ching Hsu, Hsinchu, TW;
Assignee:
Sino-American Silicon Products Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); B82Y 30/00 (2011.01); H01L 29/30 (2006.01); C30B 33/10 (2006.01); C30B 29/06 (2006.01); C30B 33/00 (2006.01);
U.S. Cl.
CPC ...
C30B 33/10 (2013.01); C30B 29/06 (2013.01); C30B 33/00 (2013.01);
Abstract
The instant disclosure relates to a nanostructuring process for an ingot surface prior to the slicing operation. A surface treatment step is performed for at least one surface of the ingot in forming a nanostructure layer thereon. The nanostructure layer is capable of enhancing the mechanical strength of the ingot surface to reduce the chipping ratio of the wafer during slicing.