Jian-Hong Chen

Title: Innovations of Jian-Hong Chen in Chip Packaging Technology

Introduction

Jian-Hong Chen is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 3 patents. His work focuses on innovative manufacturing methods that enhance the efficiency and functionality of chip packages.

Latest Patents

One of Jian-Hong Chen's latest patents is a manufacturing method of a chip package. This method involves patterning a wafer to create a scribe trench, where a light-transmissive function layer is positioned below the wafer. The light-transmissive function layer is situated between the wafer and a carrier, forming a specific angle between the outer wall surface and the wafer's surface. The process includes cutting the light-transmissive function layer and the carrier along the scribe trench to produce a chip package that consists of a chip, the light-transmissive function layer, and the carrier. Additionally, the chip is patterned to create an opening, where the light-transmissive function layer is also present, establishing a different angle between the inner wall surface of the chip and the layer.

Career Highlights

Jian-Hong Chen is currently employed at Xintec Corporation, where he continues to develop and refine his innovative ideas in chip packaging. His expertise in this area has positioned him as a key player in advancing technology within the semiconductor industry.

Collaborations

Some of his notable coworkers include Chia-Sheng Lin and Hui-Hsien Wu, who collaborate with him on various projects related to chip packaging technology.

Conclusion

Jian-Hong Chen's contributions to chip packaging technology through his innovative patents demonstrate his commitment to advancing the field. His work at Xintec Corporation and collaborations with fellow inventors further highlight his impact on the industry.