Beijing, China

Jiahui Zhang

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiahui Zhang. Retrieved from https://idiyas.com/inventor/jiahui-zhang-ptmq9c33

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jiahui Zhang - Innovator in 3D Convolution Design

Introduction: Jiahui Zhang is a talented inventor based in Beijing, China. She is currently employed at Intel Corporation, where she contributes to advancements in artificial intelligence and machine learning technologies. Although she has not yet been granted any patents, her work is focused on innovative solutions in the field of 3D convolution.

Latest Patent Applications: Jiahui Zhang's notable patent application is titled "A Generic Modular Sparse Three-Dimensional (3D) Convolution Design Utilizing Sparse 3D Group Convolution." This application is directed towards enhancing sparse 3D convolution acceleration in convolutional layers of artificial neural network models. The apparatus described includes one or more processors, including a graphics processor, to process data, and a memory for data storage, including feature maps. The processors aim to accelerate sparse 3D convolution by applying a shared 3D convolutional kernel/filter to an input feature map, producing an output feature map. This involves increasing the sparsity of the input feature map by partitioning it into multiple disjoint input groups and generating multiple disjoint output groups through convolution calculations.

Conclusion: Jiahui Zhang is making significant strides in the field of 3D convolution design, showcasing her potential as an innovator in technology. Her contributions at Intel Corporation highlight her commitment to advancing artificial intelligence applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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