Hubei, China

Jia You Wang


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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2 patents (USPTO):Explore Patents

Title: Innovations of Jia You Wang

Introduction

Jia You Wang is a notable inventor based in Hubei, China. He has made significant contributions to the field of wafer bonding technology. With a total of 2 patents, his work has garnered attention in the industry.

Latest Patents

Jia You Wang's latest patents focus on a wafer bonding method and its associated structures. The disclosed method includes several steps: performing a plasma activation treatment on the front surfaces of both a first and a second wafer, conducting a silica sol treatment on these surfaces, executing a preliminary bonding process, and finally, applying a heat treatment to bond the two wafers together. This innovative approach enhances the efficiency and effectiveness of wafer bonding.

Career Highlights

Jia You Wang is currently employed at Yangtze Memory Technologies Co., Ltd. His work at this company has positioned him as a key player in advancing memory technology. His expertise in wafer bonding has contributed to the development of cutting-edge solutions in the semiconductor industry.

Collaborations

Some of his notable coworkers include Shuai Guo and Jia Wen Wang, who is a woman. Their collaborative efforts have further enriched the research and development environment at Yangtze Memory Technologies Co., Ltd.

Conclusion

Jia You Wang's contributions to wafer bonding technology exemplify the innovative spirit of modern inventors. His patents and work at Yangtze Memory Technologies Co., Ltd. highlight the importance of collaboration and advancement in the field.

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