Jia-Hui Wang

Title: Jia-Hui Wang: Innovator in Circuit Board Technology

Introduction

Jia-Hui Wang is a notable inventor based in Hebei, China. He has made significant contributions to the field of electronics, particularly in circuit board technology. His innovative approach has led to the development of a unique circuit board that enhances performance and reliability.

Latest Patents

Jia-Hui Wang holds a patent for a circuit board and its manufacturing method. The patent describes a circuit board that includes a glass substrate, a wiring layer, an electronic component, a first build-up structure, and a second build-up structure. The glass substrate features a first surface, a second surface opposite to the first surface, and a conductive through hole connecting both surfaces. Notably, the melting point of the glass substrate is not greater than 600° C and exceeds the temperature of soldering. The wiring layer and the electronic component are integrated within the glass substrate, while the build-up structures are electrically connected to the conductive through hole.

Career Highlights

Throughout his career, Jia-Hui Wang has worked with prominent companies in the electronics sector. He has been associated with Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. and Avary Holding (Shenzhen) Co., Limited. His experience in these organizations has contributed to his expertise in circuit board design and manufacturing.

Collaborations

Jia-Hui Wang has collaborated with talented individuals in his field, including Yue Liu and Yuan-Yu Lin. These collaborations have fostered innovation and have been instrumental in advancing circuit board technology.

Conclusion

Jia-Hui Wang's contributions to circuit board technology exemplify his innovative spirit and dedication to the field. His patent and career achievements highlight his role as a significant inventor in the electronics industry.