The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
May. 22, 2024
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Hebei Province, CN;
Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;
Garuda Technology Co., Ltd., New Taipei CIty, TW;
Jia-Hui Wang, Hebei Province, CN;
Yue Liu, Hebei Province, CN;
Yuan-Yu Lin, Hebei Province, CN;
Yue Han, Hebei Province, CN;
HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd., Hebei Province, CN;
Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;
Garuda Technology Co., Ltd., New Taipei City, TW;
Abstract
A circuit board includes a glass substrate, a wiring layer, an electronic component, a first build-up structure and a second build-up structure. The glass substrate has a first surface, a second surface opposite to the first surface, and a conductive through hole connecting to the first surface and the second surface. The melting point of the glass substrate is not greater than 600° C. and is greater than the temperature of soldering. The wiring layer and the electronic component are disposed in the glass substrate. The first layer build-up structure is disposed on the first surface and is electrically connected to the conductive through hole. The second build-up structure is disposed on the second surface and is electrically connected to the conductive through hole.