Company Filing History:
Years Active: 2020
Title: Jia-De Peng: Innovator in Chemical Mechanical Polishing
Introduction
Jia-De Peng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chemical mechanical polishing, particularly in processes that enhance the performance of tungsten features in semiconductor manufacturing.
Latest Patents
Jia-De Peng holds a patent for a chemical mechanical polishing method specifically designed for tungsten. This innovative process aims to reduce dishing of tungsten features that are 100 micrometers or less. The method involves providing a substrate with tungsten features, a specialized polishing composition, and a chemical mechanical polishing pad. The process ensures that some tungsten is polished away while minimizing dishing, which is crucial for maintaining the integrity of semiconductor devices.
Career Highlights
Jia-De Peng is currently employed at Rohm and Haas Electronic Materials CMP Holdings, Inc. His work focuses on developing advanced materials and processes that are essential for the semiconductor industry. His expertise in chemical mechanical polishing has positioned him as a key player in this highly technical field.
Collaborations
Throughout his career, Jia-De Peng has collaborated with talented individuals such as Lin-Chen Ho and Syin Hsu. These collaborations have contributed to the advancement of innovative solutions in chemical mechanical polishing.
Conclusion
Jia-De Peng's contributions to the field of chemical mechanical polishing highlight his role as an innovator in semiconductor manufacturing. His patented methods are vital for improving the efficiency and effectiveness of tungsten feature processing.