Ji-Wei Sun

Title: Ji-Wei Sun: Innovator in Bimetal Layer Manufacturing

Introduction

Ji-Wei Sun is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor manufacturing. His innovative approach has led to the development of a unique bimetal layer manufacturing method.

Latest Patents

Ji-Wei Sun holds a patent for a bimetal layer manufacturing method. This method includes several intricate steps, such as forming a first dielectric layer on a semiconductor substrate with a first metal layer, creating a SOG layer, and forming a second dielectric layer. The process also involves making via holes to reach the first metal layer and forming a linear layer through PECVD. Finally, unnecessary linear layers are removed, and a second metal layer is formed where MIM capacitors will be created, ensuring that connection plugs are formed without generating via hole poison. He has 1 patent to his name.

Career Highlights

Ji-Wei Sun is currently employed at BCD Semiconductor Manufacturing Limited. His work at this company has allowed him to apply his innovative ideas in a practical setting. His contributions have been instrumental in advancing semiconductor technology.

Collaborations

Throughout his career, Ji-Wei Sun has collaborated with notable colleagues, including Hiu Fung Ip and Ellick Ma. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ji-Wei Sun is a key figure in the field of semiconductor manufacturing, with a focus on bimetal layer technology. His innovative methods and collaborative spirit continue to drive advancements in the industry.