IDiyas

For the Inventor, By the Inventor

Cheonan-si, South Korea

Ji Hwang Kim

USPTO Granted Patents = 24 

Average Co-Inventor Count = 4.5

ph-index = 4

Forward Citations = 136(Granted Patents)


Location History:

  • Bucheon-si, KR (2014 - 2015)
  • Hwasung, KR (2019)
  • Hwaseong-si, KR (2020)
  • Chungcheongnam-do, KR (2016 - 2021)
  • Cheonan-si, KR (2017 - 2024)

Company Filing History:

goldMedal24 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2014-2024

Loading Chart...
24 patents (USPTO):Explore Patents
1. 12062605 - Semiconductor package including an interposer and method of fabricating the same (2024-08-13),
2. 12057366 - Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package (2024-08-06),
3. 11908806 - Semiconductor package and method of fabricating the same (2024-02-20),
4. 11876083 - Semiconductor package (2024-01-16),
5. 11728230 - Semiconductor package and method of fabricating the same (2023-08-15),
6. 11658107 - Semiconductor package including an interposer and method of fabricating the same (2023-05-23),
7. 11600545 - Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package (2023-03-07),
8. 11569201 - Semiconductor package and method of fabricating the same (2023-01-31),
9. 11367714 - Semiconductor package device (2022-06-21),
10. 11367679 - Semiconductor package including an in interposer and method of fabricating the same (2022-06-21),
11. 11158603 - Semiconductor package and method of fabricating the same (2021-10-26),
12. 11152416 - Semiconductor package including a redistribution line (2021-10-19),
13. 11069592 - Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure (2021-07-20),
14. 10978431 - Semiconductor package with connection substrate and method of manufacturing the same (2021-04-13),
15. 10923428 - Semiconductor package having second pad electrically connected through the interposer chip to the first pad (2021-02-16),

Title: The Innovative Journey of Ji Hwang Kim in Semiconductor Technology

Introduction: Ji Hwang Kim, an accomplished inventor based in Cheonan-si, South Korea, has made significant contributions to the field of semiconductor technology. With an impressive total of 24 patents to his name, Kim has been at the forefront of developing advanced semiconductor packages that enhance the performance and functionality of electronic devices.

Latest Patents: Among his latest patents is the invention of a semiconductor package that includes an interposer and a method for fabricating it. This innovative package consists of a lower package, an interposer positioned on top of the lower package, and an under-fill layer that fills the space between them. Notably, the interposer contains a through hole that vertically penetrates it, allowing for improved thermal management and electrical connections.

Another noteworthy patent by Kim details semiconductor devices that incorporate both a lower semiconductor package and an upper semiconductor package, with a connection pattern that links the two structures. This invention provides a robust electrical connection through various structural components, such as a lower base, bonding pads, and heat sink structures, ensuring efficient operation of the device.

Career Highlights: Ji Hwang Kim’s career has primarily been associated with Samsung Electronics Co., Ltd., a leader in the semiconductor industry. Throughout his tenure, he has been instrumental in driving forward innovative technologies that significantly impact the market and technology landscape.

Collaborations: In his professional journey, Kim has collaborated with notable coworkers, including Jongbo Shim and Chajea Jo. Their collective efforts in research and development have led to advancements in semiconductor packaging, enhancing the efficiency and reliability of electronic systems.

Conclusion: Ji Hwang Kim exemplifies the spirit of innovation in the semiconductor industry. His extensive patent portfolio and collaborative efforts have established him as a key figure in pushing the boundaries of technology. As the demand for advanced semiconductor solutions continues to grow, Kim's contributions will undoubtedly play a significant role in shaping the future of electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…