The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Jun. 17, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ji Hwang Kim, Cheonan-si, KR;
Dongho Kim, Hwaseong-si, KR;
Jin-Woo Park, Seoul, KR;
Jongbo Shim, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a lower package: an upper substrate on the lower package: and connection members connecting the lower package to the upper substrate, wherein the lower package includes: a lower substrate; and a lower semiconductor chip, wherein the upper substrate includes: an upper substrate body: upper connection pads combined with the connection members: and auxiliary members extending from the upper substrate body toward the lower substrate, wherein the connection members are arranged in a first horizontal direction to form a first connection member column, wherein the auxiliary members are arranged in the first horizontal direction to form a first auxiliary member column, wherein the first connection member column and the first auxiliary member column are located between a side surface of the lower semiconductor chip and a side surface of the lower substrate, and the first auxiliary member column is spaced apart from the first connection member column.