This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2013-2021.
Location History:
- Songpa-gu, KR (2013)
- Seoul, KR (2016 - 2021)
Company Filing History:
Years Active: 2013-2021
Title: Ji Ho Uh - Innovator in Substrate Support and Flip Chip Packaging Technologies
Introduction
Ji Ho Uh is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in substrate support units and flip chip packaging methods. With a total of 3 patents to his name, his work continues to influence advancements in the industry.
Latest Patents
Among his latest patents is a substrate support unit and deposition apparatus that includes a support with an upper surface for substrate placement. This innovative design features a coupling ring that holds the substrate's edge and an arm part that facilitates the raising and lowering of the coupling ring and substrate. Another notable patent involves a flip chip packaging method, which includes printing flux on a pad of a printed circuit board (PCB) and mounting the die in a flip chip manner. This method ensures effective bonding of the die to the PCB, showcasing Ji Ho Uh's expertise in practical applications of semiconductor technology.
Career Highlights
Ji Ho Uh is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role at Samsung has allowed him to work on cutting-edge technologies that are pivotal to modern electronics. His contributions have not only advanced the company's product offerings but have also set new standards in the industry.
Collaborations
Throughout his career, Ji Ho Uh has collaborated with notable colleagues, including Il Jun Jeon and Je Hak Lee. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Ji Ho Uh's work exemplifies the spirit of innovation in the semiconductor industry. His patents and contributions continue to shape the future of technology, making him a key figure in his field.