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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9263414 B1

PDFFull Text
Date of Patent:
Feb. 16, 2016

Filed:

Dec. 17, 2013

Flip chip packaging method, and flux head manufacturing method applied to the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Kyeong Min Yeo, Hwaseong-si, KR;

Seung Min Ryu, Suwon-si, KR;

Dae Jung Kim, Seoul, KR;

Ji Ho Uh, Seoul, KR;

Suk Won Lee, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Kevin M Picardat

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); H01L 24/75 (2013.01); H05K 3/3489 (2013.01); H01L 24/13 (2013.01); H01L 2224/131 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H05K 2203/0108 (2013.01);
Abstract

Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.

Find Patent Forward Citations

Yeo, Kyeong. (2016). Flip chip packaging method, and flux head manufacturing method applied to the same (U.S. Patent No. 9263414). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9263414

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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