Company Filing History:
1 out of 54 
1 out of 54 Years Active: 2021
Title: The Innovative Journey of Ji Deng Feng in Semiconductor Technology
Introduction: Ji Deng Feng, an accomplished inventor based in Shanghai, China, has made significant contributions to the field of semiconductor technology. With a patent to his name, his innovation underscores the importance of advanced techniques in the fabrication of semiconductor structures.
Latest Patents: Ji Deng Feng's notable patent focuses on a "Semiconductor structure and method for forming same." The patent outlines a sophisticated method involving several steps which include providing a base, forming a dummy gate structure, and creating an interlayer dielectric layer. The innovation emphasizes the importance of an isolation structure that enhances device performance while minimizing residue during polishing treatments. By utilizing both metal polishing liquid and deionized water, Ji's method significantly reduces the likelihood of material residue on the interlayer dielectric layer, which is pivotal for improving overall device functionality.
Career Highlights: Throughout his career, Ji Deng Feng has been associated with leading companies in the semiconductor industry, notably the Semiconductor Manufacturing International Corporation (SMIC) in both Beijing and Shanghai. His experience in these renowned firms has equipped him with a wealth of knowledge and expertise in semiconductor fabrication techniques. His dedication to advancing technology is reflected in his innovative methods, which are crucial to the development of high-performance semiconductor devices.
Collaborations: In his professional journey, Ji has had the opportunity to collaborate with esteemed colleagues including Zhang Qing and Jin Yi. Their collective efforts have fostered an environment of innovation and progress within the semiconductor sector, driving the development of new methodologies that enhance manufacturing processes.
Conclusion: Ji Deng Feng's contributions to semiconductor technology exemplify the power of innovation in shaping the future of electronics. Through his patent and collaborations with industry professionals, he has made a lasting impact in the field, demonstrating the importance of continuous development in semiconductor structures and methodologies. As the industry evolves, Ji's work stands as a test bed for future innovations that aim to optimize device performance and reliability.