Kaohsiung, Taiwan

Jheng-Yi Li

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: National Cheng-Kung University. Active years: 2026.

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Jheng-Yi Li: Innovator in Organic/Inorganic Composite Structures

Introduction

Jheng-Yi Li is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of organic/inorganic composite structures. His innovative work has led to the filing of a patent that showcases his expertise and creativity.

Latest Patents

Jheng-Yi Li holds a patent for an "Organic/inorganic composite structure, method for manufacturing the same and sensing device." This invention features a silicon substrate that includes a plurality of microstructures on its surface. A conductive polymer layer is positioned on these microstructures, creating a spaced distance between the polymer layer and the silicon substrate. This unique design enhances the functionality of the composite structure, making it suitable for various applications.

Career Highlights

Jheng-Yi Li is affiliated with National Cheng-Kung University, where he continues to engage in research and development. His work at the university allows him to collaborate with other experts in the field and contribute to advancing technology in materials science.

Collaborations

One of his notable collaborators is Tsung-Yen Wu. Together, they work on innovative projects that push the boundaries of current technology.

Conclusion

Jheng-Yi Li's contributions to the field of organic/inorganic composite structures demonstrate his commitment to innovation and research. His patent reflects his ability to create advanced materials that have the potential to impact various industries.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…