The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Jul. 28, 2023
Applicant:

National Cheng Kung University, Tainan City, TW;

Inventors:

Chia-Yun Chen, Tainan City, TW;

Jheng-Yi Li, Kaohsiung City, TW;

Tsung-Yen Wu, Changhua County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 39/00 (2026.01); H10K 39/30 (2026.01); H10K 71/12 (2023.01);
U.S. Cl.
CPC ...
H10K 39/501 (2023.02); H10K 39/30 (2023.02); H10K 71/12 (2023.02);
Abstract

An organic/inorganic composite structure includes a silicon substrate and a conductive polymer layer. The silicon substrate includes a plurality of microstructures disposed on a surface of the silicon substrate. The conductive polymer layer is disposed on the plurality of microstructures. A spaced distance is between the conductive polymer layer and the surface of the silicon substrate.


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