This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2018.
Company Filing History:
Years Active: 2018
Title: Jh Yoon: Innovator in Electronic Device Packaging
Introduction
Jh Yoon is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of electronic device packaging. His innovative work has led to the development of a unique electronic device package technology.
Latest Patents
Jh Yoon holds a patent for an electronic device package. This technology includes a package substrate, an electronic component, a mold compound that encapsulates the electronic component, and a redistribution layer. The mold compound is positioned between the package substrate and the redistribution layer, allowing for electrical coupling between these components. This design facilitates the electrical connection between the electronic component and the package substrate, enhancing the functionality of electronic devices.
Career Highlights
Jh Yoon is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to push the boundaries of electronic packaging technology. With a focus on innovation, he continues to contribute to the development of cutting-edge electronic solutions.
Collaborations
Jh Yoon has collaborated with notable colleagues, including Mao Guo and Richard Patten. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise in the field of electronic device packaging.
Conclusion
Jh Yoon's contributions to electronic device packaging exemplify the spirit of innovation in technology. His patent and work at Intel Corporation highlight his commitment to advancing the field. Through collaboration and creativity, he continues to shape the future of electronic devices.