Company Filing History:
Years Active: 2020-2022
Title: Jerry Li: Innovator in Semiconductor Technology
Introduction
Jerry Li is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work focuses on advanced packaging techniques that enhance the performance and efficiency of electronic devices.
Latest Patents
One of Jerry Li's latest patents is titled "Pillared cavity down MIS-SiP." This invention provides a substrate with a top and bottom side, featuring redistribution layers and copper pillars. The design allows for the mounting of passive components and silicon dies, facilitating electrical connections through the redistribution layers. Another notable patent is the "Wafer level chip scale package structure." This patent outlines a process for creating copper posts on a silicon die, enhancing the integration of electronic components.
Career Highlights
Jerry Li is currently employed at Dialog Semiconductor (UK) Limited, where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in developing cutting-edge technologies that are essential for modern electronic applications.
Collaborations
Throughout his career, Jerry has collaborated with talented individuals such as Jesus Mennen Belonio, Jr. and Ernesto Gutierrez, III. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Jerry Li's contributions to semiconductor technology exemplify the spirit of innovation. His patents and career achievements highlight his dedication to advancing the field and improving electronic device performance.