East Syracuse, NY, United States of America

Jerrad Martinson

This inventor holds 1 USPTO granted patent. Top assignee: Ttm Technologies Inc.. Active years: 2023.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations by Jerrad Martinson in Printed Circuit Board Technology

Introduction

Jerrad Martinson is an accomplished inventor based in East Syracuse, NY (US). He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative approach has led to the development of a unique method for manufacturing PCBs that enhances their thermal management capabilities.

Latest Patents

Jerrad holds a patent for a "Method of manufacturing printed circuit board assemblies with engineered thermal paths." This patent describes a PCB that features engineered thermal paths through complementary cavities formed on opposite sides of the board. These cavities are designed to be in thermal and/or electrical communication, allowing for improved thermal management. Each cavity is filled with a thermally conductive material, providing an efficient thermal pathway for the circuits and components of the PCB. The manufacturing method includes drilling and/or milling the cavities, panel plating, and filling them with suitable materials.

Career Highlights

Jerrad Martinson is currently employed at TTM Technologies Inc., where he applies his expertise in PCB manufacturing. His work focuses on enhancing the performance and reliability of electronic components through innovative design and manufacturing techniques.

Collaborations

Some of Jerrad's coworkers include Rick Bauer and Shane Hoffstatter, who contribute to the collaborative environment at TTM Technologies Inc. Their combined efforts help drive advancements in PCB technology.

Conclusion

Jerrad Martinson's contributions to the field of printed circuit boards exemplify the importance of innovation in technology. His patented method for manufacturing PCBs with engineered thermal paths showcases his commitment to improving electronic component performance.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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