This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: Jeong-Sam Lee: Innovator in Semiconductor Packaging
Introduction
Jeong-Sam Lee is a prominent inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Jeong-Sam Lee holds a patent for a package substrate and a semiconductor package that incorporates this substrate. The patent describes a package substrate that includes an insulating substrate with a mount region featuring external terminals. Additionally, it has a clamp region designed to receive a molding material, which is crucial for the packaging process. The design includes a circuit pattern on the insulating substrate and a blocking member that prevents the molding material from moving into the mount region during the pressurization process. This innovation is essential for ensuring the integrity and performance of semiconductor packages.
Career Highlights
Jeong-Sam Lee is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor packaging. His patent reflects his commitment to improving product design and functionality in the electronics industry.
Collaborations
Throughout his career, Jeong-Sam Lee has collaborated with notable colleagues, including Yong-Il Kwak and Jun-Hyuk Choi. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies in semiconductor packaging.
Conclusion
Jeong-Sam Lee's contributions to semiconductor packaging through his patent and work at Samsung Electronics Co., Ltd. highlight his role as an influential inventor in the technology sector. His innovative designs continue to impact the efficiency and reliability of semiconductor devices, showcasing the importance of his work in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile