The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Sep. 11, 2009
Yong-il Kwak, Asan-si, KR;
Jun-hyuk Choi, Cheonan-si, KR;
Jeong-sam Lee, Cheonan-si, KR;
Jong-kak Jang, Asan-si, KR;
Yong-Il Kwak, Asan-si, KR;
Jun-Hyuk Choi, Cheonan-si, KR;
Jeong-Sam Lee, Cheonan-si, KR;
Jong-Kak Jang, Asan-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A package substrate includes an insulating substrate having a mount region including external terminals mounted to the insulating substrate and a clamp region having an opening receiving a molding material therein, the clamp region disposed adjacent to the mount region in a first direction, a circuit pattern formed on the insulating substrate, and a blocking member blocking the molding material from moving from the clamp region to the mount region when the package substrate loaded in a mold die is pressurized to form a molding member, wherein the blocking member is disposed on at least one side of the package substrate in the clamp region, and the blocking member receives the molding material therein.