Jeong Ho Yang

Title: Jeong Ho Yang: Innovator in Ultrasonic Calibration

Introduction

Jeong Ho Yang is a notable inventor based in Fort Washington, PA (US). He has made significant contributions to the field of wire bonding systems, particularly through his innovative methods of calibrating ultrasonic characteristics.

Latest Patents

Yang holds a patent for "Methods of calibrating an ultrasonic characteristic on a wire bonding system." This patent outlines a method that includes several steps: determining a reference ultrasonic characteristic for the formation of a wire bond, identifying a reference non-stick ultrasonic characteristic, and establishing a calibration non-stick ultrasonic characteristic on the wire bonding system. The process culminates in determining a calibration factor for the system using the reference and calibration non-stick ultrasonic characteristics. This invention is crucial for enhancing the efficiency and reliability of wire bonding processes.

Career Highlights

Jeong Ho Yang is currently employed at Kulicke and Soffa Industries, Inc., a company renowned for its advanced semiconductor packaging and assembly solutions. His work at this organization has allowed him to apply his expertise in ultrasonic calibration, contributing to the development of cutting-edge technologies in the industry.

Collaborations

Yang has collaborated with notable colleagues, including Jon W Brunner and Wei Qin. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Jeong Ho Yang's contributions to ultrasonic calibration in wire bonding systems exemplify the impact of innovative thinking in technology. His patent and work at Kulicke and Soffa Industries, Inc. highlight his role as a key player in advancing semiconductor manufacturing processes.