The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Aug. 13, 2024
Applicant:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Inventors:

Jon W. Brunner, Sellersville, PA (US);

Wei Qin, Ambler, PA (US);

Aashish Shah, Chalfont, PA (US);

Hui Xu, Chalfont, PA (US);

Jeong Ho Yang, Blue Bell, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/10 (2006.01); B23K 101/40 (2006.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
B23K 20/10 (2013.01); B23K 2101/40 (2018.08); H10W 72/07113 (2026.01); H10W 72/07141 (2026.01); H10W 72/07183 (2026.01);
Abstract

A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.


Find Patent Forward Citations

Loading…