Berlin, Germany

Jens Palm


 

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2024

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4 patents (USPTO):Explore Patents

Title: Inventor Jens Palm: Pioneering Innovations in Electrolytic Copper Plating

Introduction

Jens Palm, a distinguished inventor based in Berlin, Germany, has made significant contributions to the field of electrolytic copper plating. With a total of four patents to his name, Palm's work is characterized by innovative solutions that enhance the efficiency and effectiveness of copper deposition processes.

Latest Patents

Among Jens Palm's recent patents are notable inventions that focus on acidic aqueous compositions for electrolytic copper plating. His first patent details a composition that includes one or a mixture of two or more quinoline-polyethylene glycol containing compounds. This inventive approach seeks to optimize the plating process, making it more efficient. Another patent further elaborates on this concept, presenting an acidic aqueous composition specifically designed for the electrolytic deposition of a copper layer, providing advancements in metal coating technologies.

Career Highlights

Throughout his career, Jens Palm has been associated with prominent companies in the electrochemistry sector. He has worked at Atotech Deutschland GmbH and Atotech Deutschland GmbH & Co. KG, where he played a crucial role in the development of advanced materials and processes for electronic and industrial applications. His expertise in this field has led to significant advancements in copper plating techniques and related technologies.

Collaborations

Jens Palm has collaborated with remarkable professionals during his career, including Dirk Rohde and Ralf Schmidt. These partnerships have fostered an environment of innovation, allowing for the exchange of ideas and expertise that have propelled their projects forward.

Conclusion

In conclusion, Jens Palm stands out as a prominent inventor in the realm of electrolytic copper plating. His innovative patents and collaborative efforts demonstrate his commitment to advancing technology in this specialized field. As the industry continues to evolve, Palm's contributions will likely remain influential in shaping future developments in electrolytic processes.

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