Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Jens Palm

Josef Gaida

Dirk Rohde

Ralf Schmidt

Himendra Jha

Olivier Mann

Angela Llavona-Serrano

Kun Si

Onas Bolton

Frank Von Horsten

Willi Rohland

Frank Von-Horsten

The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising:

Acidic aqueous composition for electrolytic copper plating

The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising

Acidic aqueous composition for electrolytically depositing a copper deposit

The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising 

The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and/or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition and method for deposition of copper

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Berlin, Germany

Jens Palm