Jenn-Shyh Yu

Title: Innovations of Jenn-Shyh Yu in Chip Packaging Technology.

Introduction

Jenn-Shyh Yu is an accomplished inventor based in Fengyuan, Taiwan. She has made significant contributions to the field of chip packaging technology. Her innovative approach has led to the development of a unique patent that addresses common challenges in the industry.

Latest Patents

One of Jenn-Shyh Yu's notable patents is for a dual-sided chip package without a die pad. This invention allows a first die to be fixed directly on the lead fingers of a leadframe, a support bar, or bus bars, while a second die is attached to the first die. By eliminating the die pad, the distance between the surfaces of the dies and the plastic surface of the package increases. This design significantly reduces the likelihood of generating voids in the plastic and eliminates the need to grind the dies. Additionally, it enhances the vibration and floating characteristics of the dies during the manufacturing process, preventing exposure of the bonding wires and reducing the risk of shelling off or breaking of the dies. Overall, this invention improves the yield of chip packages.

Career Highlights

Jenn-Shyh Yu is currently employed at Siliconware Precision Industries Co., Ltd. Her work at this leading company in the semiconductor industry has allowed her to apply her innovative ideas and contribute to advancements in chip packaging technology.

Collaborations

Throughout her career, Jenn-Shyh Yu has collaborated with talented individuals such as Jui-Hsiang Hung and Chien-Ping Huang. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Jenn-Shyh Yu's contributions to chip packaging technology exemplify her innovative spirit and dedication to improving manufacturing processes. Her patent for a dual-sided chip package without a die pad showcases her ability to solve complex problems in the industry.