Jeng-Huan Yang

Title: Jeng-Huan Yang: Innovator in Semiconductor Technology

Introduction

Jeng-Huan Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of conductive lines. His innovative methods have the potential to enhance the efficiency and effectiveness of semiconductor devices.

Latest Patents

Jeng-Huan Yang holds a patent for a "Method for fabricating conductive line." This patent describes a process that begins with providing a substrate that has at least two isolation structures already formed. A first conductive layer is created between every two isolation structures, followed by the formation of a dielectric layer on the substrate. The dielectric layer is then patterned to create an opening that exposes the first conductive layer. Subsequently, a second conductive layer is formed on the substrate, and a portion of this layer outside the opening is removed to create a conductive line. This method allows for the effective electrical connection of semiconductor devices, especially as device sizes continue to shrink.

Career Highlights

Jeng-Huan Yang is currently employed at Powerchip Semiconductor Corporation, where he applies his expertise in semiconductor fabrication. His work focuses on developing innovative solutions that address the challenges posed by smaller device sizes and the limitations of traditional lithography design rules.

Collaborations

Some of Jeng-Huan Yang's coworkers include Pin-Yao Wang and Liang-Chuan Lai. Their collaborative efforts contribute to the advancement of semiconductor technologies within their organization.

Conclusion

Jeng-Huan Yang's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work at Powerchip Semiconductor Corporation highlights the importance of collaboration and innovation in addressing the challenges of modern electronics.