Jen-Fang Chang

Title: Innovations by Inventor Jen-Fang Chang

Introduction

Jen-Fang Chang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 3 patents. His work focuses on advanced methods of fabricating high-density core layers in circuit boards, which enhance their performance and reliability.

Latest Patents

Jen-Fang Chang's latest patents include innovative methods for fabricating boards with high-density core layers. One of his patents describes a method of making a board that features a plated through hole (PTH) core layer substrate with stacked multiple layers of blind vias. This method allows for more stacking layers of blind vias than conventional techniques. The fabrication process involves etching to create a flattened depression in the PTH, followed by image transfer and pattern plating to form a copper pad. Another patent outlines a circuit board design that includes a core layer substrate with a plated through hole filled with dielectric material. This design features a tapered outer portion of the filled plated through hole, which creates a depressed surface, enhancing the board's functionality.

Career Highlights

Jen-Fang Chang is currently employed at Kinsus Interconnect Technology Corp., where he continues to innovate in the field of circuit board technology. His expertise in high-density core layer fabrication has positioned him as a key player in the industry.

Collaborations

Throughout his career, Jen-Fang has collaborated with talented coworkers, including Chien-Wei Chang and Ting-Hao Lin. These collaborations have contributed to the advancement of technology in their field.

Conclusion

Jen-Fang Chang's contributions to circuit board technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future advancements.